Powertech Technology has been granted a patent for a package structure featuring a unique design with multiple layers and components, including redistribution circuit layers, dielectric bodies, conductive terminals, and insulating layers. The structure allows for efficient electrical connections between different components within the package. GlobalData’s report on Powertech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Powertech Technology, Under-screen biometric identification was a key innovation area identified from patents. Powertech Technology's grant share as of April 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Package structure with multiple dies connected through circuit layers
A recently granted patent (Publication Number: US11973037B2) discloses a package structure comprising a redistribution circuit layer, a first die, a second die, a dielectric body, a conductive terminal, a first circuit layer, and a first patterned insulating layer. The first die is electrically connected to the conductive terminal through the first circuit portion and the redistribution circuit layer, while the second die is connected to the first die through the second circuit portion. The package structure also includes features such as a conductive connecting piece between the first die and the second die, a filling layer between the second die and the first patterned insulating layer, an encapsulant covering the second die, and a heat sink thermally coupled to the second die.
Furthermore, the package structure in the patent includes additional elements such as a second circuit layer in the redistribution circuit layer, a second patterned insulating layer covering the second circuit layer, and an insulating opening filled with the seed layer of the first circuit portion. The first die and the second die each have specific components like pads and insulating layers, with direct contacts between the seed layers and the pads. The package structure also features a unique arrangement where the dielectric bottom surface is parallel but not coplanar with the conductive bottom surface, providing efficient electrical connections and insulation. Additionally, the encapsulant covering the second die exposes a portion of the second die, enhancing the functionality and accessibility of the package structure.
To know more about GlobalData’s detailed insights on Powertech Technology, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
