TE Connectivity has been granted a patent for a receptacle connector assembly with a unique design featuring stacked module channels within a receptacle cage. The assembly allows for mating with different plug modules in each channel, enhancing connectivity options. GlobalData’s report on TE Connectivity gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on TE Connectivity, Battery management systems was a key innovation area identified from patents. TE Connectivity's grant share as of January 2024 was 64%. Grant share is based on the ratio of number of grants to total number of patents.

Receptacle connector assembly with stacked module channels

Source: United States Patent and Trademark Office (USPTO). Credit: TE Connectivity Ltd

A newly granted patent (Publication Number: US11888269B2) discloses a receptacle connector assembly comprising a receptacle cage with multiple module channels stacked on top of each other. The assembly includes receptacle modules for mating with plug modules, with some modules being board modules and others cable modules. The design allows for easy integration with a circuit board, with the receptacle cage and modules all configured to be stacked on the same side of the board. The assembly also includes a lower receptacle cage for additional modules, providing flexibility in configuration.

Furthermore, the patent describes a communication system incorporating the receptacle connector assembly mounted on a circuit board. The system includes electronic packages and receptacle modules connected to the board, with some modules being directly mounted within the cage mounting area. The design ensures efficient connectivity between plug modules and the circuit board, with cables extending from certain modules to a connection area closer to the electronic package. Overall, the patented technology offers a versatile and space-saving solution for receptacle connectors in communication systems, enhancing connectivity and integration on circuit boards.

To know more about GlobalData’s detailed insights on TE Connectivity, buy the report here.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.